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Basic Info

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Product Description

Board material types: FR4, CEM-1, CEM-3, ceramic substrate board, aluminum based board, high-Tg, Rogers and more

Layers: single sided, 2 to 32 layer

Compound material lamination: 4 to 6 layers

Maximum dimensions: 610 x 1,100mm

Dimension tolerance: ±0.13mm

Board thickness coverage: 0.2 to 6.00mm

Board thickness tolerance: ±10%

DK thickness: 0.076 to 6.00mm

Minimum line width: 0.10mm

Minimum line space: 0.10mm

Outer layer copper thickness: 8.75 to 175µm

Inner layer copper thickness: 17.5 to 175µm

Drilling hole diameter (mechanical drill): 0.25 to 6.00mm

Finished hole diameter (mechanical drill): 0.20 to 6.00mm

Hole diameter tolerance (mechanical drill): 0.05mm

Hole position tolerance (mechanical drill): 0.075mm

Laser drill hole size: 0.10mm

Board thickness and hole diameter ratio: 10:1

Solder mask types: green, yellow, black, purple, blue, white and red

Minimum solder mask: Ø0.10mm

Minimum size of solder mask separation ring: 0.05mm

Solder mask oil plug hole diameter: 0.25 to 0.60mm

Impedance control tolerance: ±10%

Surface finish: hot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger

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