
Aluminum Clad PCB with 0.21 to 7.0mm Board Thickness
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Product Description
Product Description
- Professional surface-mounting and through-hole solderingtechnology
- Various sizes like 1206, 0805, 0603 components SMTtechnology
- ICT (In Circuit Test), FCT (Functional Circuit Test)technology
- PCB assembly with UL, CE, FCC and RoHS approvals
- Nitrogen gas reflow soldering technology for SMT
- High standard SMT and solder assembly line
- High density interconnected board placement technologycapacity
- Maximum board size: 23 x 25 (580 x 900mm)
- Minimum drilled hole size: 3mil (0.075mm)
- Minimum line width: 3mil (0.075mm)
- Minimum line spacing: 3mil (0.075mm)
- Surface finishing: HASL/HASL lead-free, HAL, chemical tin,chemical gold, immersion silver/gold, OSP, gold plating
- Solder mask colors: green/yellow/black/white/red/blue
- Tolerance:
- Shape tolerance: ±0.13
- Hole tolerance: PTH: ±0.076, NPTH: ±0.05
- PCB packing:
- Inner packing: vacuum packing/plastic bag
- Outer packing: standard carton packing
- Certificates: UL, ISO 9001 and ISO 14001
- Special requirements: buried and blind vias + controlledimpedance + BGA
- Profiling: punching, routing, V-cut and beveling
- Shape tolerance: ±0.13
- Hole tolerance: PTH: ±0.076, NPTH: ±0.05
- PCB packing:
- Inner packing: vacuum packing/plastic bag
- Outer packing: standard carton packing
- Certificates: UL, ISO 9001 and ISO 14001
- Special requirements: buried and blind vias + controlledimpedance + BGA
- Profiling: punching, routing, V-cut and beveling
- Inner packing: vacuum packing/plastic bag
- Outer packing: standard carton packing
- Certificates: UL, ISO 9001 and ISO 14001
- Special requirements: buried and blind vias + controlledimpedance + BGA
- Profiling: punching, routing, V-cut and beveling
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