FR4 Printed Circuit Board with 0.2 to 3.0mm Thickness

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Basic Info

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Product Description

Base materials: FR4, TG, CEM-1, aluminum

Copper thickness: 0.5-2.0oz

Thickness: 0.2-3.0mm

Solder mask: green, red, blue, yellow, black, white andmore

Line width: 0.2mm (minimum)

Line space: 0.2mm (minimum)

Hole diameter: 0.25mm (minimum)

Board size: 600 x 1,200mm (maximum)

Surface treatment: spray tin, HASL, lead-free, immersion gold,gold-plate, OSP, ENIG and more

Lead-time: seven days

Capability: 30,000 square meters/month

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