High density multilayer PCB board production factory

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Basic Info

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Product Description

Layers: 1 to 32 layers

Maximum working panel area: 457 x 610mm

Minimum board thicknesses

-layer: 0.40mm

6-layer: 0.80mm

8-layer: 1.00mm

10-layer: 1.20mm

Minimum trace width: 0.10mm

Minimum spacing: 0.10mm

Minimum hole diameter: 0.20mm

Minimum copper thickness in hole: 0.020mm

PTH size tolerance: ±0.05mm

NPTH size tolerance: ±0.025mm

Hole position tolerance: ±0.05mm

Dimension tolerance: ±0.1mm

Minimum solder mask dam: 0.08mm

Maximum board thickness/hole size rate: 10:01:00AM

Thermal shock endurance: 288, 3 times in 10sec

Maximum board twist and wrap: d0.7%

High voltage endurance: 1.3kV/mm

Copper foil peel off endurance: 1.4N/mm

Hardness of resist ink: e6H

Flame resistance: 94V-0

Impedance control: ±5%

Certificates: ISO 9001:2000, ISO 14001, ISO/TS16949:2002, ULE203640

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