OEM Service Multilayer PCB

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Basic Info

Payment Type:	T/T, PayPal or Western Union

Product Description

Max finished size: 20.9 x 24.4 (530mm x 620mm)

Board thickness standard: 0.004 to 0.16 ±10% (0.1 to4.0mm±10%)

Min single/double-sided: 0.008±0.004 (0.2mm±0.1mm)

4-layer: 0.01±0.008 (0.4mm ±0.1mm)

8-layer: 0.01±0.008 (0.4mm ±0.1mm)

Bow and twist: <7/1000

Copper weight:

Outer Cu weight: 0.5-3.0oz

Inner Cu weight: 0.5-3.0oz

Laminate materials: FR-4, FR-1, FR-2, CEM-1, CEM-3

Board cutting: max number of layers 8

Min thickness for inner layers (Cu thickness are excluded)0.003 (0.07mm)

Drilling:

Min size: 0.0078 (0.2mm)

Max size: 0.3 (8.0mm)

Drill deviation: ± 0.002 (0.050mm)

PTH hole tolerance: ± 0.002 (0.050mm)

NPTH hole tolerance: ± 0.002 (0.050mm)

Plating min hole size: 0.0008 (0.02mm)

Aspect ratio: 20(5:1)

Solder mask color: green, light green, white, black, darkbrown, yellow, red, blue

Min solder mask clearance: 0.003 (0.07mm)

Thickness: 0.0005-0.0007 (0.012-0.017mm)

Silkscreen color: white, black, yellow, red, blue, green

Min size: 0.006 (0.15mm)

Electrical testing: flying probe tester

Controlled impedance tolerance ±0.5%

Impedance tester: Tektronix TDS8200

Routing: end mills test ± 0.006 (0.15mm)

CNC tolerance ± 0.004 (0.1mm)

V-cut depth (residual thickness) FR-4 (1/3+-0.1mm), FR-1, FR-2,CEM-1, CEM-3 (1/2+-0.1mm)

V-cut angle: 15°, 18°, 30°

V-cut shape: line, hole, V-shape

Surface finish: HASL, HASL Pb-free, immersion gold, immersionsilver, immersion tin, O.S.P (Entek), S/G plating, ENEPIG, G/Fplating, carbon and more

Gold finger angle: 15°, 30°, 45°, 60°

Others:

UL certification

ISO certification, ISO9001

TS16949

ISO14000

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