High TG Multilayer PCB for Electronic Products

Get Latest Price

Quantity:

Your message must be between 20 to 2000 characters

Contact Now

Basic Info

Payment Type:	T/T, PayPal or Western Union

Product Description

Military standard assembly

Surface mount, through hole, BGA, QFP, QFN

ROHS compliant and lead-free process

ISO9001 certification

Turnkey service (PCB manufacture, components procurement andassembly)

Reliable parts

Technical requirements:

Layers: 1-30

Material: FR-4, CEM-1, CEM-3, High TG, FR4 halogen free, FR-1,FR-2, aluminum

Board thickness: 0.2-7mm

Max. finished board side: 500 x 500mm

Min. drilled hole size: 0.25mm

Min. line width: 0.075mm (3mil)

Min. line spacing: 0.075mm (3mil)

Surface finish/treatment: HALS/HALS lead free, chemical tin,chemical gold, immersion gold immersion silver/gold, OSP, goldplating

Copper thickness: 0.5-4.0oz

Solder mask color: green/black/white/red/blue/yellow

Inner packing: vacuum packing, plastic bag

Outer packing: standard carton packing

Hole tolerance:

Certificates: UL, ISO9001, ISO14001, RoHS, CQC

Profiling punching routing, V-CUT, beveling

Assembly service providing OEM service to all sorts of printedcircuit board assembly

Professional surface-mounting and through-hole solderingtechnology

Various sizes like 1206, 0805, 0603 components SMTtechnology

ICT (In Circuit Test), FCT (Functional Circuit Test)technology

PCB assembly with UL, CE, FCC, RoHS approvals

Nitrogen gas reflow soldering technology for SMT

High standard SMT and solder assembly line

High density interconnected board placement technologycapacity

PTH: ±0.076

NTPH: ±0.05

Send your message to this supplier

Related Keywords