Multilayer PCB and PCBA, RoHS Directive-compliant

Multilayer PCB and PCBA, RoHS Directive-compliant

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Basic Info

Payment Type:	T/T, PayPal or Western Union

Product Description

Surface mount, through hole, BGA, QFP and QFN

Turnkey service (PCB manufacture, components procurement andassembly)

Reliable parts

Technical requirements:

Professional surface-mounting and through-hole solderingtechnology
Various sizes like 1206, 0805, 0603 components SMTtechnology
ICT (in circuit test), FCT (functional circuit test)technology
Certifications: PCB, UL, CE, ISO 9001 and FCC
RoHS Directive-compliant
Nitrogen gas reflow soldering technology for SMT
High standard SMT and solder assembly line

High density interconnected board placement technologycapacity

Layers: 1 to 32 layers

Minimum working panel area: 457 x 610mm

Minimum board thickness:

4-layer: 0.40mm
6-layer: 0.80mm
8-layer: 1.00mm
10-layer: 1.20mm

Minimum trace width: 0.10mm

Minimum spacing: 0.10mm

Minimum hole diameter: 0.20mm

Minimum copper thickness in hole: 0.020mm

PTH size tolerance: ±0.05mm

NPTH size tolerance: ±0.025mm

Hole position tolerance: ±0.05mm

Dimension tolerance: ±0.1mm

Minimum solder mask dam: 0.08mm

Insulation resistance: 1E+12Ω (normal condition)

Minimum board thickness/hole size rate: 10:1

Thermal shock endurance: 288/3 times in 10s

Maximum Board twist and wrap: ≤0.7%

High voltage endurance: 1.3kV/mm

Copper foil peel off endurance: 1.4N/mm

Hardness of resist ink: ≥6H

Flame resistance: 94V-0

Impedance control: ±5%

Certifications: ISO 9001:2000, ISO 14001, ISO/TS 16949:2002 andUL E203640

Professional surface-mounting and through-hole solderingtechnology

Various sizes like 1206, 0805, 0603 components SMTtechnology

ICT (in circuit test), FCT (functional circuit test)technology

Certifications: PCB, UL, CE, ISO 9001 and FCC

RoHS Directive-compliant

Nitrogen gas reflow soldering technology for SMT

High standard SMT and solder assembly line

4-layer: 0.40mm

6-layer: 0.80mm

8-layer: 1.00mm

10-layer: 1.20mm

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