ODM PCB assembly with 0.21 to 7.0mm board thickness

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Basic Info

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Product Description

Layer: 1 to 28 layers

Material type: FR-4, CEM-1, CEM-3, high TG, FR4 halogen-free,Rogers

Board thickness: 0.21 to 7.0mm

Copper thickness: 0.5 to 7.0oz

Copper thickness in hole: >25.0um (>1mil)

Size:

Surface finishing: HASL/HASL lead-free, HAL, chemical tin,chemical gold, immersion silver/gold, OSP, gold plating

Solder mask color: green/yellow/black/white/red/blue

Tolerance :

PCB packing:

Certificates: UL, ISO 9001, ISO 14001

Special requirements: buried and blind vias + controlledimpedance + BGA

Profiling: punching, routing, V-cut, beveling

Maximum board size: 23 x 25 (580 x 900mm)

Minimum drilled hole size: 3mil (0.075mm)

Minimum line width: 3mil (0.075mm)

Minimum line spacing: 3mil (0.075mm)

Shape tolerance: ±0.13

Hole tolerance:

PTH: ±0.076

NPTH: ±0.05

Inner packing: vacuum packing/plastic bag

Outer packing: standard carton packing

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