OurPCB Tech. Ltd
OurPCB Tech. Ltd
Multilayer PCB Laminates with Copper Boards
  • Multilayer PCB Laminates with Copper Boards
  • Multilayer PCB Laminates with Copper Boards
Multilayer PCB Laminates with Copper Boards
Multilayer PCB Laminates with Copper Boards

Multilayer PCB Laminates with Copper Boards

Payment Type:
T/T, PayPal or Western Union
Quantity:

Your message must be between 20 to 2000 characters

Contact Now
Basic Info
Basic Info
Payment Type: T/T, PayPal or Western Union
Product Description
Product Description
  • Layer 1 to 28 layers
  • Material type FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free,Rogers
  • Board thickness 0.21mm to 7.0mm
  • Copper thickness: 0.5 to 7.0oz
  • Copper thickness in hole: >25.0um (>1mil)
  • Size:
    • Maximum board size: 23 x 25 (580 x 900mm)
    • Minimum drilled hole size: 3mil (0.075mm)
    • Minimum line width: 3mil (0.075mm)
    • Minimum line spacing: 3mil (0.075mm)
  • Surface finishes: HASL/HASL lead-free, HAL, chemical tin,chemical gold, immersion silver/gold, OSP, gold plating
  • Solder mask colors: green/yellow/black/white/red/blue
  • Tolerance:
    • Shape tolerance: ±0.13
    • Hole tolerance:
      • PTH: ±0.076
      • NPTH: ±0.05
  • PCB packing:
    • Inner packing: vacuum packing/plastic bag
    • Outer packing: standard carton packing
  • Certificate UL, ISO 9001, ISO 14001
  • Special requirements: buried and blind vias + controlledimpedance + BGA
  • Profiling: punching, routing, V-cut, beveling
  • Contract manufacturing
  • Engineering services
  • PCB design and assembly
  • Prototyping
  • Cable and wire assemblies
  • Plastics and molds
  • Military standard assembly
  • Surface mount, through hole, BGA, QFP, QFN
  • Compliant with RoHS Directive and lead-free process
  • ISO9001-certified
  • Turnkey service (PCB manufacture, components procurement andassembly)
  • Reliable parts
  • Technical requirement:
    • Professional surface-mounting and through-hole solderingtechnology
    • Various sizes like 1206, 0805, 0603 components SMTtechnology
    • ICT (In Circuit Test), FCT (Functional Circuit Test)technology
    • PCB assembly with UL, CE, FCC and RoHS approvals
    • Nitrogen gas reflow soldering technology for SMT
    • High standard SMT and solder assembly line
    • High density interconnected board placement technologycapacity
  • Maximum board size: 23 x 25 (580 x 900mm)
  • Minimum drilled hole size: 3mil (0.075mm)
  • Minimum line width: 3mil (0.075mm)
  • Minimum line spacing: 3mil (0.075mm)
  • Shape tolerance: ±0.13
  • Hole tolerance:
    • PTH: ±0.076
    • NPTH: ±0.05
  • PTH: ±0.076
  • NPTH: ±0.05
  • Inner packing: vacuum packing/plastic bag
  • Outer packing: standard carton packing
  • Professional surface-mounting and through-hole solderingtechnology
  • Various sizes like 1206, 0805, 0603 components SMTtechnology
  • ICT (In Circuit Test), FCT (Functional Circuit Test)technology
  • PCB assembly with UL, CE, FCC and RoHS approvals
  • Nitrogen gas reflow soldering technology for SMT
  • High standard SMT and solder assembly line
  • High density interconnected board placement technologycapacity
  • Send your message to this supplier

    • Ms.  Rachel

    • Enter between 20 to 4,000 characters.

    Related Keywords

    Related Keywords