Copper Clad Laminate Polyimide (PI )Film for PCB
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$30.00≥50 Square Meter
- Min. Order:
- 50 Square Meter
- Min. Order:
- 50 Square Meter
- Transportation:
- Air, Express, Ocean, Land
- Port:
- TIANJIN, QINGDAO
Quantity:
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Contact NowBasic Info
Basic Info
| Supply Ability: | 5000 |
|---|---|
| Payment Type: | T/T |
| Incoterm: | EXW,Express Delivery,FOB,DDP,FCA |
| HS Code: | 3920991000 |
| Transportation: | Air,Express,Ocean,Land |
| Port: | TIANJIN,QINGDAO |
Product Description
Product Description
Copper Clad Laminate Polyimide (PI )Film for PCB
Our Flexible Copper Clad Laminate Polyimide (PI) Film is a high performance material designed specifically for the production of Flexible Printed Circuits (FPC) and Rigid - Flex Printed Circuit Boards (PCB). It combines the excellent properties of polyimide film with high - quality copper foil, providing a reliable and versatile solution for modern electronics manufacturing.
2. Features
2.1 Exceptional Flexibility
The polyimide film base endows this product with outstanding flexibility. It can be bent, folded, and twisted repeatedly without losing its electrical or mechanical properties. This makes it ideal for applications where space is limited and complex 3D layouts are required, such as in wearable devices, where the FPC needs to conform to the shape of the human body, or in the hinge mechanisms of foldable smartphones, enabling smooth folding and unfolding operations.
2.2 High - Temperature Resistance
Polyimide is known for its remarkable high - temperature resistance. Our PI - based copper clad laminate can withstand high temperatures during soldering processes, with a soldering resistance temperature of up to 288℃ without experiencing issues like bubbling or delamination. This high - temperature stability ensures that the FPC and Rigid - Flex PCB can operate reliably in environments with elevated temperatures, such as in automotive engine compartments where electronic components are exposed to heat generated by the engine.
2.3 Excellent Electrical Insulation
The polyimide film offers excellent electrical insulation properties. It effectively isolates the conductive copper traces, preventing electrical leakage and short - circuits. This feature is crucial for maintaining the integrity and proper functioning of the circuits, especially in high - density FPC and Rigid - Flex PCB designs where multiple conductive layers are in close proximity.
2.4 Chemical Stability and Resistance
It has strong chemical stability and resistance to various chemical solvents. This makes it suitable for use in industrial and automotive applications where the electronic components may be exposed to chemicals, oils, or other corrosive substances. For example, in industrial automation equipment, the FPCs made from this material can endure the harsh chemical environment in manufacturing plants.
2.5 High Bond Strength between Copper Foil and PI Film
The copper foil is firmly bonded to the polyimide film. This high bond strength ensures that the two materials remain intact during the manufacturing process of FPC and Rigid - Flex PCB, as well as during the long - term use of the final products. It prevents the copper foil from peeling off the film, which could lead to electrical failures.
3. Application Scenarios
3.1 Flexible Printed Circuits (FPC)
3.2 Rigid - Flex Printed Circuit Boards (PCB) ：Automotive Electronics， Aerospace and Defense
Product pictures:
Contact:
Our company is establised in 2004. we have much experience in plastic film.
Our main products including :1.Metallized Film (Metallized Polyester film , Metallized Polyimide film , Copper clad PI Film and Copper Metallized PET Film )
Our main products including :1.Metallized Film (Metallized Polyester film , Metallized Polyimide film , Copper clad PI Film and Copper Metallized PET Film )
2.Color PET Film (PET Milky White Film , PET White Film , PET Black Film ect )
3.3D Holographic Foil 4.PI FILM ect These products are widely applied to the packaging and printing of the industries including electronical products, food, commodities, medicine, labels, gifts etc.If you need anything, please feel free to contact me.
3.3D Holographic Foil 4.PI FILM ect These products are widely applied to the packaging and printing of the industries including electronical products, food, commodities, medicine, labels, gifts etc.If you need anything, please feel free to contact me.
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